It’s help you understand if our capabilities are a match for your design.
Supported PCB Assembly Variants
Surface Mount technology (SMT)
Through-hole technology (THT)
Mixed Technology (SMT / Through hole)
Single or double-sided placement
Types of Solder paste for Assembly
Leaded
Lead-free (RoHS Compliant)
PCB Stencils Type
Framed stencil
Frameless stencil
Minimum Order
We do not have any minimum order quantity constraints.
Types of Components
Passive Components, as small as 01005, 0201, 0402
BGA
Fine Pitch Parts (QFN, QFP)
Small Chip Packages, 01005
Maximum Size: 56 X 56 X 15 mm
Via on Solder Pad
The solder pad vias are available based on the compatibility of the requirement with the design. Since the solder passes through the via, it is not prominently visible. If this is acceptable to your design standards our team can work on the solder pad vias.
However, the functionality is not available for BGA.
Minimum Pad Size for BGA
0.20 mm
BGA/QFN pad edge to edge clearance conditions for feasibility
The following conditions must be met in order to make edge-to-edge clearance viable:
1. Clearance > 0.17 mm (without a dam)
2. Clearance is between 0.15 mm and 0.17 mm (viable only with a dam)
3. Clearance < 0.15 mm is not feasible or recommended
Clearance from the Board’s Edge to the Component
3.00 mm (Less than 3.00 mm is acceptable for less than 4 pads towards edge and only for passive components)
PCB Board Shapes
We can assemble boards in Rectangular, Circular and any other Unusual shapes (for shapes other than rectangle, the boards must be panelized in an array, and a panel border needs to be added at the two longer paralleled edges of the panelized boards to ensure that the boards can be assembled by the machine)
PCB Materials
For Rigid PCBs, our offerings are FR4,Rogers and MCPCB.
For Flexible PCBs please connect with our technical sales support team at pcb@pcbpower.com for availability and feasibility.
Maximum size: 370.00 mm x 290.00 mm ( Stencil size should not be larger than 290 mm)
Minimum size: 50.00 mm on any side
For Component Pitch <= 0.50 mm (BGA/QFN)
Maximum size: 200.00 mm x 200.00 mm(Solder dam is preferable)
PCB Board thickness: (0.40 mm - 3.2 mm)
Maximum size: 150.00 mm x 150.00 mm
PCB Board thickness < 0.40 mm
It is not Feasible with us.
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