Technical Capabilities (All values are in mm)
Specification | Value |
---|---|
Max. no. of Layers | 24 |
Max. Board Size (L x W) |
430 x 585 (For SS & DS) 415 x 565 (For Multi layers) |
Max. Board Thickness | 3.20 |
Min. Finished Board Thickness | 0.20 (No HAL / Masking) |
Base Materials
Specification | Value |
---|---|
Base Material | FR4 |
Inner Layer Copper Cladding | |
* Max. Cu Wt. For Planes (Oz.) | 2 |
* Max. Cu Wt. For Signals (Oz.) | 2 |
* Min. Cu Wt. (Oz.) | 0.5 |
c) | Outer Layer Copper Clading |
* Max Cu Wt. (Oz.) | 3 |
* Min Cu Wt. (Oz.) | 0.5 |
Circuit Layers (All values are in mm)
Specification | Value | ||
---|---|---|---|
For Start Copper Thickness of 0.5 Oz. | |||
For Outer Layer | Min Track Width | 0.09 | |
For Outer Layer | Min Spacing | 0.09 | |
For Inner Layer | Min Track Width | 0.125 | |
For Inner Layer | Min. Spacing | 0.125 | |
For Start Copper Thickness of 1.0 Oz. | |||
Min Track Width | 0.15 | ||
Min. Spacing | 0.15 | ||
For Start Copper Thickness of 2.0 Oz. | |||
Min Track Width | 0.175 | ||
Min. Spacing | 0.20 |
Drilling (All values are in mm)
Specification | Value |
---|---|
Min. Finished via Hole Size | 0.10 |
Min. Finished via Pad Size | |
Outer Layers | 0.40 |
Inner Layers | 0.45 |
Min. Annular Ring | 0.10 |
Drill to Drill Clearance | 0.15 |
Min. Slot Size For PTH Slots (Tool size) | 0.50 |
Blind & Buried vias Manufacturable | Yes |
Drill to Track Clearance For Inner Layers (upto 6 layer) | 0.25 |
Drill to Track Clearance for Inner Layers (>6 layer) | 0.35 |
Min. Drill Size For Plated Holes on Board Edge | 0.80 |
Min. Drill to Drill Clearance For Plated Holes on Board Edge | 0.80 |
Surface Finish
Specification | Value |
---|---|
HASL (Lead free & PB/Sn both) | Yes |
Electrolytic Gold | Yes |
Electroless Nickle / Gold | Yes |
Immersion Tin | Yes |
Layer construction Impedance Design (All values are in mm)
Specification | Value |
---|---|
Min. Core Thickness | 0.15 |
Min. Possible Dielectric Thickness | 0.15 |
Controlled Impedance Measurement | Yes |
Solder Mask (All values are in mm)
Specification | Value |
---|---|
Mask Opening | |
Green & Blue Masking | 0.06 |
Min. Soldermask Web Width Between Pads | 0.08 |
Mask Opening | |
Other than Green & Blue Masking | 0.120 |
Min. Soldermask Web Width Between Pads | 0.120 |
SM to Trace Clearance | 0.10 |
Via Fill Max Drill Size | 0.40 |
Legend (All values are in mm)
Specification | Value |
---|---|
Legend Line Width | 0.15 to 0.20 |
Min. Character Height | 1.00 |
Scoring
Specification | Value |
---|---|
Angle For v-cut | 30 degree |
Jump Scoring | Yes |
Routing (All values are in mm)
Specification | Value |
---|---|
Min. Router Size | 0.80 |
Copper Clearance from PCB Edge (All values are in mm)
Specification | Value |
---|---|
For Routing | 0.25 |
For Scoring | 0.45 |
For Inner layer | 0.4 |
Carbon (All values are in mm)
Specification | Value |
---|---|
Min. Line Width | 0.30 |
Min. Carbon – Carbon Spacing | 0.25 |
Peelable (All values are in mm)
Specification | Value |
---|---|
Minimum Width of Any Peel-off Element | 0.50 |
Maximum Coverable Hole ENDSIZE | 6.00 |
Minimum Overlap on Copper Pattern | 0.254 |
Minimum Clearance to Free Copper | 0.254 |
Minimum Distance From PCB Outline | 0.50 |
Drill Tolerances (All values are in mm)
PTH Hole Size | PTH Tolerance | NPTH Hole Size | NPTH Tolerance |
---|---|---|---|
0.50-3.50 | +/- 0.10 | 3 | +/- 0.10 |
>3.50 | +/- 0.15 | >3 | +/- 0.15 |
Other Tolerances
PCB Size | PCB Thickness | Trace Width / Spacing | Copper Thickness Inside Hole | Bow & twist tolerance |
---|---|---|---|---|
+/- 0.20 mm | +/- 20% (Up to 0.8 mm thickness) | +/- 0.20 % | >= 0.0002 | +/- 1% |
+/- 10% (Above 1.0 mm thickness) |
Available Finishes
RoHS Compliances finishes | Non-RoHS Finish |
---|---|
Lead Free HAL | HAL(sn PB) |
Immersion Tin | - |
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni) | - |
Legend Colours
Color | Value |
---|---|
White | Yes |
Black | Yes |
Yellow | Yes |
Solder Mask Colours
Color | Value |
---|---|
Green | Yes |
Black | Yes |
White | Yes |
Blue | Yes |
Red | Yes |
Technologies
Color | Value |
---|---|
Impedance Control | Yes |
Blind / Buried Vias | Yes |
Carbon Printing | Yes |
Hard Gold Tabs | Yes |
Peelable Solder Mask | Yes |